Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12046530 | Thermal bridge interposer structure | Je-Hsiung Lan, Jonghae Kim | 2024-07-23 |
| 11984874 | Surface acoustic wave (SAW) filter packages employing an enhanced thermally conductive cavity frame for heat dissipation, and related fabrication methods | Jonghae Kim, Je-Hsiung Lan | 2024-05-14 |
| 11862367 | ESL-less AC resistor for high frequency applications | Jonghae Kim, Sang-June Park, Je-Hsiung Lan | 2024-01-02 |