Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12119277 | Method for producing package substrate for mounting semiconductor device | Syunsuke Hirano, Takaaki Ogashiwa | 2024-10-15 |
| 11990349 | Method for producing package substrate for loading semiconductor device | Syunsuke Hirano, Takaaki Ogashiwa | 2024-05-21 |
| 11915931 | Extreme ultraviolet lithography patterning method | Choong-Man Lee, Soo Doo Chae, Angelique Raley, Qiaowei Lou, Toshio Hasegawa | 2024-02-27 |
| 11877396 | Laminate, metal foil-clad laminate, laminate having patterned metal foil, laminate having buildup structure, printed wiring board, multilayer coreless substrate, and method for producing same | Syunsuke Hirano, Takaaki Ogashiwa | 2024-01-16 |