Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12119277 | Method for producing package substrate for mounting semiconductor device | Yoshihiro Kato, Takaaki Ogashiwa | 2024-10-15 |
| 11990349 | Method for producing package substrate for loading semiconductor device | Yoshihiro Kato, Takaaki Ogashiwa | 2024-05-21 |
| 11877396 | Laminate, metal foil-clad laminate, laminate having patterned metal foil, laminate having buildup structure, printed wiring board, multilayer coreless substrate, and method for producing same | Yoshihiro Kato, Takaaki Ogashiwa | 2024-01-16 |