Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12134696 | Resin composition, prepreg, resin sheet, laminate, metal foil-clad laminate, and printed wiring board | Tetsuro Miyahira, Tatsuro TAKAMURA, Sayaka ITO | 2024-11-05 |
| 12119277 | Method for producing package substrate for mounting semiconductor device | Syunsuke Hirano, Yoshihiro Kato | 2024-10-15 |
| 11990349 | Method for producing package substrate for loading semiconductor device | Syunsuke Hirano, Yoshihiro Kato | 2024-05-21 |
| 11877396 | Laminate, metal foil-clad laminate, laminate having patterned metal foil, laminate having buildup structure, printed wiring board, multilayer coreless substrate, and method for producing same | Syunsuke Hirano, Yoshihiro Kato | 2024-01-16 |