Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183723 | Semiconductor package with dummy MIM capacitor die | Yao-Chun Su, Chih-Ching Chen, I-Hsuan Peng | 2024-12-31 |
| 12142598 | Semiconductor package structure having an annular frame with truncated corners | Chia-Cheng Chang, Tzu-Hung Lin, I-Hsuan Peng | 2024-11-12 |
| 12021031 | Semiconductor package structure | Yi-Lin Tsai, I-Hsuan Peng, Wen-Sung Hsu | 2024-06-25 |
| 11862578 | Semiconductor package structure | Chia-Cheng Chang, Tzu-Hung Lin, I-Hsuan Peng | 2024-01-02 |