Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183723 | Semiconductor package with dummy MIM capacitor die | Yao-Chun Su, I-Hsuan Peng, Yi-Jou Lin | 2024-12-31 |
| 11925002 | Casing structure with functionality of effective thermal management | Jian-Jia Huang, Chun-Kai Lin | 2024-03-05 |