Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11908819 | Semiconductor packaging substrate fine pitch metal bump and reinforcement structures | Jun Chung Hsu, Chih-Ming Chung, Jun Zhai, Yifan Kao, Young Doo Jeon | 2024-02-20 |
| 11862597 | Asymmetric stackup structure for SoC package substrates | Yikang Deng, Yifan Kao, Jun Chung Hsu | 2024-01-02 |