Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11973095 | Method for forming chip package with second opening surrounding first opening having conductive structure therein | Chia-Ming Cheng, Chia-Sheng Lin | 2024-04-30 |
| 11942563 | Manufacturing method of chip package and chip package | Chia-Sheng Lin, Hui-Hsien Wu, Jian-Hong Chen, Tsang-Yu Liu | 2024-03-26 |