Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11973095 | Method for forming chip package with second opening surrounding first opening having conductive structure therein | Kuei-Wei Chen, Chia-Sheng Lin | 2024-04-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11973095 | Method for forming chip package with second opening surrounding first opening having conductive structure therein | Kuei-Wei Chen, Chia-Sheng Lin | 2024-04-30 |