Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11908819 | Semiconductor packaging substrate fine pitch metal bump and reinforcement structures | Chih-Ming Chung, Jun Zhai, Yifan Kao, Young Doo Jeon, Taegui Kim | 2024-02-20 |
| 11862597 | Asymmetric stackup structure for SoC package substrates | Yikang Deng, Taegui Kim, Yifan Kao | 2024-01-02 |