Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12107076 | Through-silicon via layout for multi-die integrated circuits | Wonjun Jung, Tyrone Tung Huang, Christopher Klement, Alan Dodson Smith, Edward Chang +1 more | 2024-10-01 |