Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12046560 | Microelectronic device with embedded die substrate on interposer | Robert Alan May, Sri Ranga Sai Boyapati, Sheng Li, Kristof Darmawikarta, Robert L. Sankman +1 more | 2024-07-23 |
| 12040276 | Device and method of very high density routing used with embedded multi-die interconnect bridge | Robert Alan May, Wei-Lun Kane Jen, Jonathan L. Rosch, Kristof Darmawikarta | 2024-07-16 |
| 12014989 | Device and method of very high density routing used with embedded multi-die interconnect bridge | Robert Alan May, Wei-Lun Kane Jen, Jonathan L. Rosch, Kristof Darmawikarta | 2024-06-18 |
| 11894311 | Microelectronic device with embedded die substrate on interposer | Robert Alan May, Sri Ranga Sai Boyapati, Sheng Li, Kristof Darmawikarta, Robert L. Sankman +1 more | 2024-02-06 |