Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165961 | Semiconductor package structure | Zheng Zeng, Che-Hung Kuo | 2024-12-10 |
| 12095142 | Semiconductor package having discrete antenna device | Wen-Chou Wu, Yi-Chieh Lin, Chia-Yu Jin | 2024-09-17 |
| 11967570 | Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure | Chia-Hao Hsu, Tai-Yu Chen, Shiann-Tsong Tsai, Yao-Pang Hsu, Chi-Yuan Chen +1 more | 2024-04-23 |
| 11908759 | Semiconductor device | Nan-Cheng Chen, Che-Ya Chou, Che-Hung Kuo | 2024-02-20 |
| 11908767 | Semiconductor package structure | Che-Hung Kuo, Chia-Hao Hsu | 2024-02-20 |