Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148736 | Three-dimensional bonding scheme and associated systems and methods | Kelvin Tan Aik Boo, Seng Kim Ye, Chin Hui Chong | 2024-11-19 |
| 12080616 | Reinforced semiconductor device packaging and associated systems and methods | Suresh Upadhyayula, Yeow Chon Ong | 2024-09-03 |
| 11942460 | Systems and methods for reducing the size of a semiconductor assembly | Kelvin Tan Aik Boo, Chin Hui Chong, Hem Takiar, Seng Kim Ye | 2024-03-26 |
| 11929351 | Integrated circuit wire bonded to a multi-layer substrate having an open area that exposes wire bond pads at a surface of the inner layer | Kelvin Tan Aik Boo, Chin Hui Chong, Seng Kim Ye, Hem Takiar | 2024-03-12 |
| 11908833 | Overlapping die stacks for nand package architecture | Enyong Tai, Hem Takiar, Li-Ping Wang | 2024-02-20 |
| 11894289 | Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods | Chin Hui Chong, Hem Takiar, Seng Kim Ye, Kelvin Tan Aik Boo | 2024-02-06 |