Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148736 | Three-dimensional bonding scheme and associated systems and methods | Hong Wan Ng, Seng Kim Ye, Chin Hui Chong | 2024-11-19 |
| 11929351 | Integrated circuit wire bonded to a multi-layer substrate having an open area that exposes wire bond pads at a surface of the inner layer | Chin Hui Chong, Seng Kim Ye, Hong Wan Ng, Hem Takiar | 2024-03-12 |
| 11894289 | Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods | Hong Wan Ng, Chin Hui Chong, Hem Takiar, Seng Kim Ye | 2024-02-06 |