Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148736 | Three-dimensional bonding scheme and associated systems and methods | Kelvin Tan Aik Boo, Hong Wan Ng, Seng Kim Ye | 2024-11-19 |
| 11942460 | Systems and methods for reducing the size of a semiconductor assembly | Hong Wan Ng, Kelvin Tan Aik Boo, Hem Takiar, Seng Kim Ye | 2024-03-26 |
| 11929351 | Integrated circuit wire bonded to a multi-layer substrate having an open area that exposes wire bond pads at a surface of the inner layer | Kelvin Tan Aik Boo, Seng Kim Ye, Hong Wan Ng, Hem Takiar | 2024-03-12 |
| 11894289 | Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods | Hong Wan Ng, Hem Takiar, Seng Kim Ye, Kelvin Tan Aik Boo | 2024-02-06 |