Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11942460 | Systems and methods for reducing the size of a semiconductor assembly | Hong Wan Ng, Kelvin Tan Aik Boo, Chin Hui Chong, Seng Kim Ye | 2024-03-26 |
| 11929351 | Integrated circuit wire bonded to a multi-layer substrate having an open area that exposes wire bond pads at a surface of the inner layer | Kelvin Tan Aik Boo, Chin Hui Chong, Seng Kim Ye, Hong Wan Ng | 2024-03-12 |
| 11908833 | Overlapping die stacks for nand package architecture | Enyong Tai, Li-Ping Wang, Hong Wan Ng | 2024-02-20 |
| 11894289 | Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods | Hong Wan Ng, Chin Hui Chong, Seng Kim Ye, Kelvin Tan Aik Boo | 2024-02-06 |