Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080616 | Reinforced semiconductor device packaging and associated systems and methods | Suresh Upadhyayula, Hong Wan Ng | 2024-09-03 |
YO
Yeow Chon Ong
Overall (2024): #211,048 of 561,600Top 40%
1
Patents 2024