Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11935799 | Integrated circuit package lids with polymer features | Elah Bozorg-Grayeli, Taylor Gaines, Sergio Antonio Chan Arguedas, Robert F. Cheney | 2024-03-19 |
| 11935861 | Underfill flow management in electronic assemblies | Taylor Gaines, Edvin Cetegen, Wei Li, Hsin-Yu Li, Tony Dambrauskas | 2024-03-19 |