Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12051647 | Pitch translation architecture for semiconductor package including embedded interconnect bridge | Andrew Collins, Rajasekaran Swaminathan, Ram Viswanath | 2024-07-30 |
| 11901248 | Embedded die architecture and method of making | Robert L. Sankman, Rahul N. Manepalli, Robert Alan May, Srinivas V. Pietambaram | 2024-02-13 |