Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12166003 | RF amplifier devices including top side contacts and methods of manufacturing | Basim Noori, Marvin Marbell, Scott Sheppard, Kwangmo Chris Lim, Qianli Mu | 2024-12-10 |
| 12119239 | Packaged semiconductor devices, and package molds for forming packaged semiconductor devices | Soon Lee Liew, Eng Wah Woo, Kok Meng Kam, Samantha Cheang | 2024-10-15 |
| 12100630 | Packaged RF power device with PCB routing outside protective member | Marvin Marbell, Melvin Nava, Jeremy Fisher | 2024-09-24 |
| 12080660 | Package with different types of semiconductor dies attached to a flange | Xikun Zhang, Dejiang Chang, Bill Agar, Michael Lefevre | 2024-09-03 |
| 12051669 | Contact and die attach metallization for silicon carbide based devices and related methods of sputtering eutectic alloys | Kevin Shawne Schneider, Scott Sheppard | 2024-07-30 |
| 12034419 | RF amplifiers having shielded transmission line structures | Kwangmo Chris Lim, Basim Noori, Qianli Mu, Marvin Marbell, Scott Sheppard | 2024-07-09 |
| 12009286 | Methods of forming packaged semiconductor devices and leadframes for semiconductor device packages | Soon Lee Liew, Eng Wah Woo | 2024-06-11 |
| 11935879 | Integrated passive device (IPD) components and a package and processes implementing the same | Eng Wah Woo, Samantha Cheang, Kok Meng Kam, Marvin Mabell, Haedong Jang | 2024-03-19 |