Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12119239 | Packaged semiconductor devices, and package molds for forming packaged semiconductor devices | Soon Lee Liew, Eng Wah Woo, Alexander Komposch, Kok Meng Kam | 2024-10-15 |
| 11935879 | Integrated passive device (IPD) components and a package and processes implementing the same | Eng Wah Woo, Kok Meng Kam, Marvin Mabell, Haedong Jang, Alexander Komposch | 2024-03-19 |