Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12119239 | Packaged semiconductor devices, and package molds for forming packaged semiconductor devices | Eng Wah Woo, Alexander Komposch, Kok Meng Kam, Samantha Cheang | 2024-10-15 |
| 12009286 | Methods of forming packaged semiconductor devices and leadframes for semiconductor device packages | Eng Wah Woo, Alexander Komposch | 2024-06-11 |