Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080660 | Package with different types of semiconductor dies attached to a flange | Dejiang Chang, Bill Agar, Michael Lefevre, Alexander Komposch | 2024-09-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080660 | Package with different types of semiconductor dies attached to a flange | Dejiang Chang, Bill Agar, Michael Lefevre, Alexander Komposch | 2024-09-03 |