Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080660 | Package with different types of semiconductor dies attached to a flange | Xikun Zhang, Dejiang Chang, Bill Agar, Alexander Komposch | 2024-09-03 |
| 11936342 | Output-integrated transistor amplifier device packages incorporating internal connections | Marvin Marbell, Jonathan Chang, Haedong Jang, Qianli Mu, Jeremy Fisher +1 more | 2024-03-19 |