Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148685 | Redistribution layer structure | Hung-Sheng Chou, Kuo-Jung Fan, Heng-Shen Yeh, Cheng-Chi Wang | 2024-11-19 |
| 12142554 | Electronic component and manufacturing method thereof | Yeong-E Chen, Yi-Hung Lin, Cheng-En Cheng, Cheng-Chi Wang | 2024-11-12 |
| 12131917 | Manufacturing method of package structure | Yi-Hung Lin, Cheng-Chi Wang, Yi-Chen Chou, Fuh-Tsang Wu, Ker-Yih Kao | 2024-10-29 |