Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148685 | Redistribution layer structure | Wen-Hsiang Liao, Kuo-Jung Fan, Heng-Shen Yeh, Cheng-Chi Wang | 2024-11-19 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148685 | Redistribution layer structure | Wen-Hsiang Liao, Kuo-Jung Fan, Heng-Shen Yeh, Cheng-Chi Wang | 2024-11-19 |