Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148685 | Redistribution layer structure | Hung-Sheng Chou, Wen-Hsiang Liao, Kuo-Jung Fan, Cheng-Chi Wang | 2024-11-19 |
| 12107036 | Redistribution layer structure and manufacturing method thereof | Kuo-Jung Fan, Cheng-Chi Wang, Chuan-Ming Yeh | 2024-10-01 |