Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12107036 | Redistribution layer structure and manufacturing method thereof | Kuo-Jung Fan, Cheng-Chi Wang, Heng-Shen Yeh | 2024-10-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12107036 | Redistribution layer structure and manufacturing method thereof | Kuo-Jung Fan, Cheng-Chi Wang, Heng-Shen Yeh | 2024-10-01 |