Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148630 | Method for manufacturing electronic device | Cheng-En Cheng, Yu-Ting Liu, Cheng-Chi Wang | 2024-11-19 |
| 12148686 | Package device and manufacturing method thereof | Cheng-En Cheng, Yu-Ting Liu | 2024-11-19 |
| 12148658 | Method for manufacturing an electronic device | Cheng-Chi Wang, Cheng-En Cheng | 2024-11-19 |
| 12142554 | Electronic component and manufacturing method thereof | Yi-Hung Lin, Cheng-En Cheng, Wen-Hsiang Liao, Cheng-Chi Wang | 2024-11-12 |
| 12075566 | Bonding pad structure | Yu-Ting Liu, Chean Kee | 2024-08-27 |
| 12050374 | Electronic device | Bi-Ly LIN | 2024-07-30 |
| 11901315 | Package device | Wei Chen, Chun-Yuan Huang | 2024-02-13 |