Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12131917 | Manufacturing method of package structure | Yi-Hung Lin, Wen-Hsiang Liao, Cheng-Chi Wang, Yi-Chen Chou, Ker-Yih Kao | 2024-10-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12131917 | Manufacturing method of package structure | Yi-Hung Lin, Wen-Hsiang Liao, Cheng-Chi Wang, Yi-Chen Chou, Ker-Yih Kao | 2024-10-29 |