Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148699 | High aspect ratio buried power rail metallization | Devika Sarkar Grant, Fee Li Lie, Hosadurga Shobha, Thamarai S. Devarajan, Aakrati Jain | 2024-11-19 |
| 12080709 | Dual inner spacer epitaxy in monolithic stacked FETs | Julien Frougier, Nicolas Loubet, Ruilong Xie | 2024-09-03 |
| 11956296 | Stream alterations under limited bandwidth conditions | John S. Werner, Arkadiy O. Tsfasman | 2024-04-09 |
| 11908791 | Partial subtractive supervia enabling hyper-scaling | Nicholas Anthony Lanzillo | 2024-02-20 |
| 11894361 | Co-integrated logic, electrostatic discharge, and well contact devices on a substrate | Julien Frougier, Anthony I. Chou, Andrew M. Greene, Ruilong Xie, Veeraraghavan S. Basker +4 more | 2024-02-06 |