DG

Devika Sarkar Grant

IBM: 2 patents #931 of 5,109Top 20%
📍 Rensselaer, NY: #3 of 11 inventorsTop 30%
🗺 New York: #2,004 of 12,119 inventorsTop 20%
Overall (2024): #172,207 of 561,600Top 35%
2
Patents 2024

Issued Patents 2024

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
12148699 High aspect ratio buried power rail metallization Sagarika Mukesh, Fee Li Lie, Hosadurga Shobha, Thamarai S. Devarajan, Aakrati Jain 2024-11-19
12046511 Selective metal residue and liner cleanse for post-subtractive etch Somnath Ghosh 2024-07-23