Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12066968 | Communication interface structure and Die-to-Die package | Chih-Chiang Hung, Yuan-Hung Lin, Shih-Hsuan Hsu, Igor Elkanovich | 2024-08-20 |
| 11869845 | Semiconductor package device and semiconductor wiring substrate thereof | Wei-Chiao WANG, Yi-Tzeng LIN | 2024-01-09 |
| 11869846 | Interposer routing structure and semiconductor package | Hao-Yu Tung, Hung-Yi Chang, Wei-Chiao WANG, Yi-Tzeng LIN | 2024-01-09 |