Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12066968 | Communication interface structure and Die-to-Die package | Sheng-Fan Yang, Chih-Chiang Hung, Shih-Hsuan Hsu, Igor Elkanovich | 2024-08-20 |
YL
Yuan-Hung Lin
Global Unichip: 1 patents #9 of 31Top 30%
Overall (2024): #201,351 of 561,600Top 40%
1
Patents 2024