Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12066968 | Communication interface structure and Die-to-Die package | Sheng-Fan Yang, Yuan-Hung Lin, Shih-Hsuan Hsu, Igor Elkanovich | 2024-08-20 |
CH
Chih-Chiang Hung
Global Unichip: 1 patents #9 of 31Top 30%
Overall (2024): #511,999 of 561,600Top 95%
1
Patents 2024