Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12117864 | Interface device and signal transceiving method thereof | Bi-Yang Li, Igor Elkanovich, Shih-Cheng Kao | 2024-10-15 |
| 12077667 | Resin composition | Te-Chao Liao, Chien Kai Wei | 2024-09-03 |
| 11920036 | Rubber resin material with high dielectric constant | Te-Chao Liao, Chien Kai Wei, Chia-Lin Liu | 2024-03-05 |
| 11903127 | Fluoride-based resin prepreg and circuit substrate using the same | Te-Chao Liao, Hao-Sheng Chen, Chih-Kai Chang | 2024-02-13 |
| 11900953 | Audio processing device and audio processing method | Chun-Chang Liu, Jing-Chu Chan | 2024-02-13 |
| 11890832 | Prepreg and metallic clad laminate | Te-Chao Liao, Hao-Sheng Chen, Chih-Kai Chang, Chia-Lin Liu | 2024-02-06 |
| 11869846 | Interposer routing structure and semiconductor package | Sheng-Fan Yang, Hao-Yu Tung, Wei-Chiao WANG, Yi-Tzeng LIN | 2024-01-09 |
| 11859083 | Low-dielectric rubber resin material and low-dielectric metal substrate | Te-Chao Liao, Chia-Lin Liu, Chien Kai Wei | 2024-01-02 |