Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11869845 | Semiconductor package device and semiconductor wiring substrate thereof | Sheng-Fan Yang, Yi-Tzeng LIN | 2024-01-09 |
| 11869846 | Interposer routing structure and semiconductor package | Sheng-Fan Yang, Hao-Yu Tung, Hung-Yi Chang, Yi-Tzeng LIN | 2024-01-09 |