Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11920036 | Rubber resin material with high dielectric constant | Te-Chao Liao, Hung-Yi Chang, Chien Kai Wei | 2024-03-05 |
| 11890832 | Prepreg and metallic clad laminate | Te-Chao Liao, Hao-Sheng Chen, Hung-Yi Chang, Chih-Kai Chang | 2024-02-06 |
| 11859083 | Low-dielectric rubber resin material and low-dielectric metal substrate | Te-Chao Liao, Hung-Yi Chang, Chien Kai Wei | 2024-01-02 |