Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12138717 | Method for manufacturing double-layer fair mugs | Hong Zhao, Daohai Yang, Huabo Wang, Liang-Yuh Chen, Bingjian Zhu +2 more | 2024-11-12 |
| 12051642 | QFN semiconductor package, semiconductor package and lead frame | You Ge, Meng Kong Lye | 2024-07-30 |
| 12021063 | Circular bond finger pad | Joan Rey Villarba BUOT, Aniket PATIL, Hong Bok We | 2024-06-25 |
| 11983636 | Automated analytical model retraining with a knowledge graph | Matthew Kujawinski, Teresa Sheausan Tung, Louis Gerald Farfan | 2024-05-14 |
| 11984408 | Cavity formed in a molding compound of a semiconductor package to reduce mechanical stress on a portion of a die in the package, and methods of formation | You Ge, Yit Meng Lee, Mariano Layson Ching, Jr. | 2024-05-14 |
| 11934390 | Approaches for knowledge graph pruning based on sampling and information gain theory | Teresa Sheausan Tung, Colin Anil Puri | 2024-03-19 |