Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12100645 | Integrated circuit (IC) package employing added metal for embedded metal traces in ETS-based substrate for reduced signal path impedance, and related fabrication methods | Aniket PATIL, Joan Rey Villarba BUOT | 2024-09-24 |
| 12021063 | Circular bond finger pad | Joan Rey Villarba BUOT, Aniket PATIL, Zhijie Wang | 2024-06-25 |
| 11955409 | Substrate comprising interconnects in a core layer configured for skew matching | Aniket PATIL, Joan Rey Villarba BUOT | 2024-04-09 |
| 11948877 | Hybrid package apparatus and method of fabricating | Aniket PATIL, Brigham NAVAJA | 2024-04-02 |