Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12100645 | Integrated circuit (IC) package employing added metal for embedded metal traces in ETS-based substrate for reduced signal path impedance, and related fabrication methods | Aniket PATIL, Hong Bok We | 2024-09-24 |
| 12021063 | Circular bond finger pad | Aniket PATIL, Zhijie Wang, Hong Bok We | 2024-06-25 |
| 11955409 | Substrate comprising interconnects in a core layer configured for skew matching | Aniket PATIL, Hong Bok We | 2024-04-09 |