Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11984408 | Cavity formed in a molding compound of a semiconductor package to reduce mechanical stress on a portion of a die in the package, and methods of formation | You Ge, Zhijie Wang, Yit Meng Lee | 2024-05-14 |
| 11923275 | Lead-frame assembly, semiconductor package and methods for improved adhesion | Allen Marfil Descartin, Jun Li | 2024-03-05 |