Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12051642 | QFN semiconductor package, semiconductor package and lead frame | Zhijie Wang, Meng Kong Lye | 2024-07-30 |
| 11984408 | Cavity formed in a molding compound of a semiconductor package to reduce mechanical stress on a portion of a die in the package, and methods of formation | Zhijie Wang, Yit Meng Lee, Mariano Layson Ching, Jr. | 2024-05-14 |