Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11923275 | Lead-frame assembly, semiconductor package and methods for improved adhesion | Mariano Layson Ching, Jr., Jun Li | 2024-03-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11923275 | Lead-frame assembly, semiconductor package and methods for improved adhesion | Mariano Layson Ching, Jr., Jun Li | 2024-03-05 |