Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176259 | Semiconductor package structure | Yung-Shun Chang | 2024-12-24 |
| 12166009 | Semiconductor device packages and methods of manufacturing the same | Tang-Yuan Chen, Meng-Kai SHIH, Shin-Luh TARNG, Chih-Pin Hung | 2024-12-10 |
| 11894317 | Package structure and method for manufacturing the same | Po-Hsien Ke, Chih-Pin Hung | 2024-02-06 |
| 11887928 | Package structure with interposer encapsulated by an encapsulant | Yung-Shun Chang, Sheng-Wen Yang, Yen-Liang Huang | 2024-01-30 |