Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176259 | Semiconductor package structure | Teck-Chong Lee | 2024-12-24 |
| 11887928 | Package structure with interposer encapsulated by an encapsulant | Sheng-Wen Yang, Teck-Chong Lee, Yen-Liang Huang | 2024-01-30 |