Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11887928 | Package structure with interposer encapsulated by an encapsulant | Yung-Shun Chang, Teck-Chong Lee, Yen-Liang Huang | 2024-01-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11887928 | Package structure with interposer encapsulated by an encapsulant | Yung-Shun Chang, Teck-Chong Lee, Yen-Liang Huang | 2024-01-30 |