Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11894317 | Package structure and method for manufacturing the same | Teck-Chong Lee, Chih-Pin Hung | 2024-02-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11894317 | Package structure and method for manufacturing the same | Teck-Chong Lee, Chih-Pin Hung | 2024-02-06 |