Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12166009 | Semiconductor device packages and methods of manufacturing the same | Tang-Yuan Chen, Meng-Kai SHIH, Teck-Chong Lee, Chih-Pin Hung | 2024-12-10 |
| 12111114 | Heat transfer element, method for forming the same and semiconductor structure comprising the same | Hung-Hsien Huang, Ian HU, Chien-Neng Liao, Jui-Cheng Yu, Po-Cheng Huang | 2024-10-08 |